Details

---

Features

• Mainly designed for semiconductor integrated circuit IC packaging and LED bracket cleaning processes
• Can clean four different widths of products simultaneously, and the number oftracks can be increased or decreased
• Adjustable track width, compatible with products of different specifications and sizes, and independent sheet cleaning greatly improves cleaning uniformity
• Automatic transmission of lead frame, automatic return to the material box after cleaning, full automation, no contactreduce the risk of secondary pollution
• Proprietary discharge structure and gas path design greatly improve the eficiency and uniformity of plasma surface activation decontamination